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BuildTak

Ref.: BTAK203X203

9.90 €

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Approximate delivery date: Wednesday 20 November

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3D printing surfaces BuildTak have emerged to solve the warping and sticking problems on the basis of 3D printers.

BuildTak emerges as the solution to the particular problems of the blue ribbon, the Kapton Tape or 3DLac. It is a sheet of thin, durable plastic that adheres to bed 3D FFF / FDM printer and resists heat.

BuildTak operated filaments ABS, PLA, HIPS, PETG, ceramic, wood, flexible (TPE), nylon and T-Glase [PETT] (While these last two types of plastics may need to add a thin layer of 3DLac on the sheet or glue stick).

3D printing surfaces BuildTak are much easier to install than Kapton Tape as they rarely get air bubbles. It also protects the motherboard from the 3D printer. The BuildTak are much more rigid than the adhesive tapes as the Blue Tape or Kapton Tape so are much easier to install and much less susceptible to the appearance of air bubbles beneath the surface.

BuildTak are heat resistant and can be reused many times in a row and multiple types of materials without having to be changing every time you print such as Kapton Tape or 3DLac.

BuildTak creates an optimum connection between the printed 3D object surface, maximizing the chances of printing as it ensures us that the piece is maintained in the right place and minimizing the warping effect. Upon completion us facilitates separation of the piece of printing surface. To avoid damaging the sheet, it is advisable to use the BuildTak spatula, designed specifically for 3D printing.

3D printing surfaces BuildTak are made of high quality raw material and are designed to withstand the high temperatures of the base of typical 3D printing FFF / FDM printing.

General information
Manufacturer	BuildTak
Print bed temperature	110-125 ºC

Other
HS Code	3919.9

BuildTak placement is very simple. Only it consists of the following steps:

Clean the surface on which will settle the sheet BuildTak sure it is free of debris.
BuildTak trim the sheet to fit the exact dimensions desired.
Should remove the adhesive backing and adhere the white sheet BuildTak motherboard 3D printer with a plastic spatula. It should start from a corner and finish on the other opposite corner, smoothing the BuildTak sheet with plastic spatula.
Surface should be recalibrated to ensure that the nozzle height is adjusted properly. (Usually the first layer is typically between 0.1 mm and 0.25 mm).

Then in the following video you can appreciate the simple steps for proper placement of the BuildTak sheets.

To ensure the longevity of the film to use a spatula BuildTak with rounded corners to take off part of it and thus avoid using objects tipped corner or sharp objects that deteriorate the BuildTak sheets. In addition you should avoid the use of solvent such as acetone to clean the surface of the lámina.A when replacing the BuildTak occurs simply and easily in one piece, leaving only the thermal adhesive residue.

When leveling the extrusion nozzle 3D printer must ensure that it doesn´t rub against the BuildTak sheet. So it is recommended to adjust the height of the nozzle to no less than the thickness of a sheet of paper. In trying to achieve optimum nozzle height, it is best to start with a height of the flexible nozzle, making a test print / leveling and simply decrease the height of the nozzle in small increments until the print tests sticking (Paying close attention to the first layer of printing). In this way we will know immediately if the nozzle is too far, because the extruded filament does not stick and if any damage on the BuildTak sheet will not occur. Only we have to reduce the height of the nozzle slightly and then perform a test until the first layer adheres. Proper leveling favors directly to the longevity of the lamina propria of 3D printing surface BuildTak (Will not be subject to much wear and tear).

Therefore, in the case that the impressions not stick to BuildTak will generally cause the extrusion nozzle is too far from the BuildTak sheet, so should proceed correctly leveled.

For printing with PLA it will not be necessary to have hot base with the mere presence of the BuildTak.