3DXSTAT ESD PC
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3DXSTAT ESD PC

3DXTECH-ESD-PC-175-750
130.00 € 130.00 €
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In stock 6 units available for immediate shipping.
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Available for shipment within 0 - 0 days

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Approximate delivery date: Thursday 26 December

The 3DXSTAT ESD PC filament is a polycarbonate based material with electrostatic discharge protection properties. It is designed and manufactured by 3DxTech using state of the art multi-wall carbon nanotube technology, cutting-edge compounding practices and precise extrusion processes. The result is a filament with excellent thermomecanical, chemical and electrical properties: great ductility and impact resistance, high heat resistance, improved retention of impact and elongation, very low odor emitted while printing, low particulate contamination, and minimal contribution to outgassing and ionic contamination.

The surface resistivity of the 3DXSTAT ESD PC filament has a value of 107 to 109 Ohm/sq, depending on the extrusion temperature chosen. Parts 3D printed with the 3DXSTAT ESD PC filament can be "manipulated" to be more conductive or more insulating by, respectively, raising or lowering the extrusion temperature. The results may differ depending on the part's geometry and thickness but also on the 3D printer, so the conductivity values shown in the table below should be taken only as a reference and used for the user's own experiments.

The surface resistance as a function of the extrusion temperature

Image 1: The surface resistance as a function of the extrusion temperature. Source: 3DxTech.

In order to 3D print complex parts with the 3DXSTAT ESD PC filament, the use of support structures and a 3D printer with two extruders is required. The support material compatible with 3DXSTAT ESD PC is the water soluble AquaTek X1 USM support filament. It offers the benefit of easier support removal and an excellent surface finish of the part.

Thanks to its thermomechanical resistance and conductive properties, the 3DXSTAT ESD PC filament can be used to 3D print parts that will be responsible of protecting sensitive electrical devices from the damaging consequences of electrostatic discharge. Thus, the 3DXSTAT ESD PC filament can be used to print prototypes as well as end use parts for the automotive, electric/electronic or oil and gas industries, specifically for semi-conductive applications (HDD components, wafer handling, jigs, casings, connectors)and industrial conveying, metering, and sensing applications.

General information

Material PC
Format 750 g
Density 1.24 g/cm³
Filament diameter 1.75 mm
Filament tolerance ± 0.05 mm
Filament length (Ø 1.75 mm-0.75 Kg) ±251.5 m

Electrical properties

Surface electrical resistivity (ASTM D257) > 10⁷ - 10⁹ < Ohm/sq

Printing properties

Printing temperature 260 - 300 ºC
Print bed temperature 110 - 120 ºC
Chamber temperature
Cooling fan -
Recommended printing speed - mm/s

Mechanical properties

Elongation at break (ISO 527) 6 %
Tensile strength (ISO 527) 68 MPa
Tensile modulus (ISO 527) 2300 MPa
Flexural strength (ISO 178) 95 MPa
Flexural modulus (ISO 178) 2310 MPa
Surface hardness -
Impact strength 20 KJ/m²

Thermal properties

Softening temperature 118 ºC

Specific properties

Chemical resistance

Other

HS Code 3916.9
Spool diameter (outer) 200 mm
Spool diameter (inner hole) 52 mm
Spool width 55 mm

The 3DXSTAT ESD PC filament should be stored properly in order to prevent it from absorbing excess moisture. Humidity is the biggest enemy of filaments as it can result in extrusion problems, poor surface quality of the 3D printed part and a deterioration in its mechanical properties. The best way to store the 3DXSTAT ESD PC filament is in a sealed bag with desiccant, in a vacuum sealed container or in an intelligent filament container. During printing, the Fiber Three drying case can be used. If the 3DXSTAT ESD PC filament absorbs too much moisture, it should dried in a filament dryer for 4 hours at 120 ºC.

The 3DXSTAT ESD PC filament should be printed at a temperature of 280-310 ºC, on a bed heated to 110-120 ºC. It is also recommended to use a 3D printed with a heated chamber if possible as it can help prevent warping. Another way to prevent warping and improve adhesion of the 3D printed part to the printing surface (especially with large parts) is to use the Magigoo adhesive.

Featured properties

Printing temperature
260 - 300 ºC
Filament diameter
1.75 mm
ESD
Yes
Density
1,24 g/cm³

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