Display Nav Left

Language:

-10%

Compare

You must be logged in to manage your wishlist.

3DXSTAT ESD PC

Ref.: 3DXTECH-ESD-PC-175-750

130.00 €

-10%

117.00 €

Tax excl.

Diameter

Format

Colour

Quantity

In stock 10 units available for immediate shipping.
units available for shipping in 0 - 0 days Available for shipment within 0 - 0 days

Product temporarily out of stock with these characteristics. Select another combination.

We notify you when it will be available:

Approximate delivery date: Friday 22 November

Available

Returns

Ask about this product

The 3DXSTAT ESD PC filament is a polycarbonate based material with electrostatic discharge protection properties. It is designed and manufactured by 3DxTech using state of the art multi-wall carbon nanotube technology, cutting-edge compounding practices and precise extrusion processes. The result is a filament with excellent thermomecanical, chemical and electrical properties: great ductility and impact resistance, high heat resistance, improved retention of impact and elongation, very low odor emitted while printing, low particulate contamination, and minimal contribution to outgassing and ionic contamination.

The surface resistivity of the 3DXSTAT ESD PC filament has a value of 10⁷ to 10⁹ Ohm/sq, depending on the extrusion temperature chosen. Parts 3D printed with the 3DXSTAT ESD PC filament can be "manipulated" to be more conductive or more insulating by, respectively, raising or lowering the extrusion temperature. The results may differ depending on the part's geometry and thickness but also on the 3D printer, so the conductivity values shown in the table below should be taken only as a reference and used for the user's own experiments.

The surface resistance as a function of the extrusion temperature

Image 1: The surface resistance as a function of the extrusion temperature. Source: 3DxTech.

In order to 3D print complex parts with the 3DXSTAT ESD PC filament, the use of support structures and a 3D printer with two extruders is required. The support material compatible with 3DXSTAT ESD PC is the water soluble AquaTek X1 USM support filament. It offers the benefit of easier support removal and an excellent surface finish of the part.

Thanks to its thermomechanical resistance and conductive properties, the 3DXSTAT ESD PC filament can be used to 3D print parts that will be responsible of protecting sensitive electrical devices from the damaging consequences of electrostatic discharge. Thus, the 3DXSTAT ESD PC filament can be used to print prototypes as well as end use parts for the automotive, electric/electronic or oil and gas industries, specifically for semi-conductive applications (HDD components, wafer handling, jigs, casings, connectors)and industrial conveying, metering, and sensing applications.

General information
Material	PC
Format	750 g
Density	1.24 g/cm³
Filament diameter	1.75 mm
Filament tolerance	± 0.05 mm
Filament length	(Ø 1.75 mm-0.75 Kg) ±251.5 m

Mechanical properties
Elongation at break	(ISO 527) 6 %
Tensile strength	(ISO 527) 68 MPa
Tensile modulus	(ISO 527) 2300 MPa
Flexural strength	(ISO 178) 95 MPa
Flexural modulus	(ISO 178) 2310 MPa
Surface hardness	-
Impact strength	20 KJ/m²

Electrical properties
Surface electrical resistivity	(ASTM D257) > 10⁷ - 10⁹ < Ohm/sq

Printing properties
Printing temperature	260 - 300 ºC
Print bed temperature	110 - 120 ºC
Chamber temperature	✓
Cooling fan	-
Recommended printing speed	- mm/s

Thermal properties
Softening temperature	118 ºC

Specific properties
Chemical resistance	✓

Other
HS Code	3916.9
Spool diameter (outer)	200 mm
Spool diameter (inner hole)	52 mm
Spool width	55 mm

The 3DXSTAT ESD PC filament should be stored properly in order to prevent it from absorbing excess moisture. Humidity is the biggest enemy of filaments as it can result in extrusion problems, poor surface quality of the 3D printed part and a deterioration in its mechanical properties. The best way to store the 3DXSTAT ESD PC filament is in a sealed bag with desiccant, in a vacuum sealed container or in an intelligent filament container. During printing, the Fiber Three drying case can be used. If the 3DXSTAT ESD PC filament absorbs too much moisture, it should dried in a filament dryer for 4 hours at 120 ºC.

The 3DXSTAT ESD PC filament should be printed at a temperature of 280-310 ºC, on a bed heated to 110-120 ºC. It is also recommended to use a 3D printed with a heated chamber if possible as it can help prevent warping. Another way to prevent warping and improve adhesion of the 3D printed part to the printing surface (especially with large parts) is to use the Magigoo adhesive.