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Lay-Cloud

LAY-CLOUD-175-R250
25.90 € 25.90 €
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LAY-CLOUD filament is a water-soluble filament like PVA, but the main difference between them is that LAY-CLOUD is the first filament on the market specifically designed to be used as a support material with flexible filaments such as the FilaFlex or NinjaFlex TPE, Flexfill TPU, and other flexible or semi-flexible materials.

It has been shown that it is the soluble filament with greater adhesion to flexible filaments such as TPU. Once the flexible part is inserted with the LAY-CLOUD support material, the latter is to be dissolved in a liquid residue. Isn´t usually appreciated how important it is to be able to separate the supports without causing damage to the final piece when trying to remove them, that is why the LAY-CLOUD filament, being a water soluble material to combine with flexible materials, will never have this problem.

LAY-CLOUD filament is also positioned in a range of printing temperatures similar to those of HiPS (230-240 ° C), which together with PVA is the other great material used as a carrier material. The great disadvantage of HiPS is that it is removed with D-Limonene solvent. D-Limonene has a high cost (compared to water), it is polluting and has an odor that persists for a certain time.

Therefore, the LAY-CLOUD 3D printing filament is an excellent support material for flexible parts that need support structures for which a 3D printer with double extruder  is required. After completing the 3D printing of the piece, simply place it in a container with cold or hot water for a few hours so that this LAY-CLOUD support material dissolves completely and there is no trace of it (Hot water will accelerate the dissolution process Of LAY-CLOUD, although in cold water it is totally soluble).

Because it is a water-soluble material it is imperative to store this material in a dry environment. For this, the 250 gram LAY-CLOUD coils come inside a self-sealing bag to isolate the filament from moisture in the air. With the LAY-CLOUD filament, you will be able to make your FFF / FDM 3D printer with unimaginable parts if it were not for the help of this revolutionary filament. LAY-CLOUD filament is developed and manufactured by the prestigious manufacturer of filaments for 3D printing Lay filaments, inventor among other filaments to this day very widespread in the market such as Lay-Brick, Lay-Wood, , MoldLay, Poro-Lay, etc.

General information
Material PVA/BVOH
Format 50 g / 250 g
Density - g/cm³
Filament diameter 1.75 / 2.85 mm
Filament tolerance ± 0.1 mm
Filament length -

Mechanical properties
Elongation at break - %
Tensile strength - MPa
Tensile modulus - MPa
Flexural strength - MPa
Flexural modulus - MPa
Surface hardness -

Printing properties
Printing temperature 230 - 240 ºC
Print bed temperature 40 ºC
Chamber temperature ✗
Cooling fan ✓
Recommended printing speed - mm/s

Thermal properties
Softening temperature - ºC

Specific properties
Transparency ✗

Other
HS Code 3916.9
Spool diameter (outer) 200 mm
Spool diameter (inner hole) 125 mm
Spool width 30 mm

It is not necessary to have a warm bed in order to print with LAY-CLOUD. It is recommended to apply 3DLac or Blue Tape to the base of the printer for better adhesion. Depending on the printing parameters used (nozzle diameter, print speed or layer height), it is likely that the optimum printing temperature can vary for each 3D printer.

Masterspool format

The 250 g. format of the Lay-Cloud filament can sometimes cause problems during the printing process because it does not include a spool that helps the correct supply of material from the 3D printer.

To avoid this type of problem when printing this and other filaments that are sold in masterspool format you can use a variable spool holder. Thanks to the use of this device, all kinds of tangles and overlaps derived from the absence of a spool are largely avoided.

Featured properties

Printing temperature
230 - 240 ºC
Filament diameter
1.75 / 2.85 mm

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