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The copper powder on one side offers more resistance to the filament than the standard PLA and on the other it gives a similar appearance and density to the copper metal.
The amount of copper contained in this material is sufficient for transmission and heat dissipation applications, resistant parts or parts with a finish that need to simulate copper in any of its states (bright, rusty, old ...). But this percentage of copper isn't enough to be a conductor of electricity. In the case of searching for a conductive filament of electricity, the Conductive PLA filament or the Graphene filament should be chosen.
Once the piece is printed, you can choose an infinite number of different finishes. Here are some of the Post-Processing techniques for this material:
The thermal treatment reinforces the structure of the Copper HTPLA, giving it greater resistance to deformation at high temperatures, maintaining its shape up to 170ºC. The tempering process is very simple, you simply need a domestic oven at a temperature of 110ºC and introduce the piece about 10 minutes, having to adapt the time depending on the size of the piece, the larger, the longer the tempering must be.
The Copper HTPLA filament has an infinity of applications, among which are:
This material has been optimized to have a lower moisture absorption than conventional PLA and get a better flow to avoid clogging, something to which some Special PLA containing fibers or metal powders are prone.