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  • Copper HTPLA Proto-Pasta

    New product

    17 Items

    19,95 €tax excl.
    24,14 €tax incl.

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    Filament composed of PLA and copper powder recommended for printing heat sinks and figures with an identical finish to copper.

    The HTPLA Copper is composed of a polymer (PLA) and copper powder, compatible with any desktop 3D printer FDM/FFF. 

    The copper powder on one side offers more resistance to the filament than the standard PLA and on the other it gives a similar appearance and density to the copper metal.

    The amount of copper contained in this material is sufficient for transmission and heat dissipation applications, resistant parts or parts with a finish that need to simulate copper in any of its states (bright, rusty, old ...). But this percentage of copper isn't enough to be a conductor of electricity. In the case of searching for a conductive filament of electricity, the Conductive PLA filament or the Graphene filament should be chosen.

    Once the piece is printed, you can choose an infinite number of different finishes. Here are some of the Post-Processing techniques for this material:

    • Apply a heat treatment to the piece to make it more resistant to harsher environments and more resistant to wear.
    • With a wire brush expose the metal so that it rusts or get a glossy and satin finish.
    • Treat the surface with steel wool for a dark appearance, but at the same time smooth and shiny.
    • Paint the deeper areas with a dark color to highlight the contrast of colors.
    • Polish with a rotary machine with a cotton tip and a polishing compound on the high areas to achieve a high gloss.
    • Polish with sandpaper to obtain a smooth, shiny and light-colored surface finish.
    • Patina (oxidize) naturally or in an accelerated manner with hydrogen peroxide (apple cider vinegar) and salt (50/50). Heat can be applied to make the process even faster.

    Figures printed with Copper HTPLA

    Image 1: Figures printed with Copper HTPLA. Source: Proto Pasta

     

    The thermal treatment reinforces the structure of the Copper HTPLA, giving it greater resistance to deformation at high temperatures, maintaining its shape up to 170ºC. The tempering process is very simple, you simply need a domestic oven at a temperature of 110ºC and introduce the piece about 10 minutes, having to adapt the time depending on the size of the piece, the larger, the longer the tempering must be.

    The Copper HTPLA filament has an infinity of applications, among which are:

    • Pieces with appearance similar to brick or clay (Terracotta).
    • Accessories and hardware.
    • Simulation of old knobs and buttons.
    • Heat exchangers and heat sinks.
    • Elements of fine arts and sculptures.
    • Emblems and trophies.
    • Jewelry like rings, pendants or bracelets.
    • Game pieces or replicas of ancient figures.

    Different finish of Copper HTPLA

    Image 2: Different finish of Copper HTPLA. Source: Proto Pasta

     

    This material has been optimized to have a lower moisture absorption than conventional PLA and get a better flow to avoid clogging, something to which some Special PLA containing fibers or metal powders are prone.

    The print is recommended to clean the nozzle by passing through it PLA or Smart Clean to avoid leaving traces of carbon fiber in it. Carbon Fiber PLA in filament state is more fragile than the standard PLA so must be handled carefully to avoid breakage. Optimum printing temperature can range between 185ºC and 215ºC according to each 3D printer. It's recommended to use hardened steel nozzles or the powerful Nozzle Olsson Ruby with a diameter equal to or greater than 0.5mm.


    Printing of this filament is just as easy to standard PLA. Although it is not necessary to have a warm bed to print this filament, if she have put it at 30-60 ° C it is recommended. The adhesion of the first layer is key and probably the most important factors for good impressions. so you can use Magigoo, DimaFixPrintaFix or BuildTak.


    • Fabricant: Proto Pasta

    • Model: Copper HTPLA

    • Base resin: HTPLA heat treatable

    • Additive: Real copper powder

    • Particle size: Less than 0.250mm

    • Odor: Almost nil

    • Density: 2.3 g/cm3

    • Heat treatment: 110ºC for 10 minutes

    • Total loss of stiffness (before heat treatment): 50-60C (Tg)

    • Total loss of stiffness (after heat treatment): 150-175C (fusion)

    • Change of dimension (before heat treatment): 0% on the axes X / Y / Z

    • Change of dimension (after heat treatment): 1.5% of contraction in the axes X / Y and 1% of growth in the axis Z

    • Print speed: 20-80 mm/s

    • Nozzle temperature: 185-215ºC

    • Type of nozzle: Hardened steel or Olsson Ruby

    • Diameter of the nozzle: Above 0.50mm

    • Layer thickness (recommended): 0.15-0.20mm

    • Base temperature: 30-60ºC

    • HS Code: 3916.9

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