IND403 HDT80 High Modulus resin - Loctite 3D
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IND403 HDT80 High Modulus resin - Loctite 3D

RS-LOC-IND403-HDT80-BLACK-1KG
230.00 € 230.00 €
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In stock 3 units available for immediate shipping.
units available for shipping in 5 - 7 days
Available for shipment within 5 - 7 days

Product temporarily out of stock with these characteristics. Select another combination.

Product temporarily out of stock with these characteristics. Select another combination.

We notify you when it will be available:

Approximate delivery date: Monday 30 September

The IND403 HDT80 High Modulus resin from the Loctite family of high temperature resins is characterized by high heat deflection temperature (80 ºC), and it prints tough parts with good dimensional stability and a great surface finish, capable of withstanding mechanical stresses and maintaining their properties over long periods of time.

The IND403 HDT80 High Modulus resin is the perfect material for the additive manufacturing of tooling and molds (silicone casting, low pressure molding, open mold PU molding), as well as interior applications in the automotive sector, fast product development and rapid process iteration.

A part 3D printed with the Loctite IND403 HDT80 High Modulus resin

Image 1: A part 3D printed with the Loctite IND403 HDT80 High Modulus resin. Source: Loctite.

The IND403 HDT80 High Modulus resin has been formulated to print optimally on industrial DLP printers. Before printing with this material, the user should read safety and technical information available in the Downloads section. In the Usage Tips section useful resources can be found on printer compatibility, recommended post-processing settings, and proper resin storage.

Curing, washing, and sintering properties

Washing time 2 - 4 min
Curing time 4 - 20 min

General information

Manufacturer Loctite
Material Photopolymer
Format 1 kg / 5 kg
Technology DLP/LCD
Wavelength - nm
Viscosity (ASTM D7867) @ 25 ºC: 100-200 cP
Density (solid) (ASTM D1475) 1.2 g/cm³
Density (liquid) (ASTM D1475) 1.08 g/cm³

Printing properties

Layer height - µm
Layer exposure time -
Layer off time -
Lifting height - mm
Bottom layer exposure -
Bottom layer count -

Mechanical properties

Izod impact strength - KJ/m²
Charpy impact strength - KJ/m²
Elongation at break (ASTM D638) 10 %
Tensile strength (ASTM D638) 67 MPa
Tensile modulus (ASTM D638) 2572 MPa
Flexural strength - MPa
Flexural modulus (ASTM D638) 2654 MPa
Surface hardness (ASTM D648) Shore 78 D

Electrical properties

Volumetric resistivity (ASTM D257) 2.5 E+15 Ω/cm
Surface electrical resistivity (ASTM D257) 1.9 E+15 Ω/cm
Dielectric strength (ASTM D149) 25+1 kV/mm
Dissipation factor (ASTM D150) 0.014-0.040
Permittivity (ASTM D150) 4.0-4.7

Thermal properties

Softening temperature 82 ºC
Softening temperature 82 ºC
Heat deflexion temperature (ASTM D648) @ 0.45 MPa: 82 ± 1 ºC / @ 1.82 MPa: 65 ± 1 ºC
Thermal expansion coefficient (ASTM E831) 72-76 µm/(m·K)
Thermal conductivity (ASTM D5930) 222 ± 2 mW/(m·K)

Specific properties

Maximum water absorption (ASTM D570) 24 h: 1.8 ± 0.2 % / 72 h: 4.0 ± 0.3 % / 168 h: 5.0 ± 0.1 %

Other

HS Code 2916.1
Lifetime (since manufacturing) - M

On the Henkel YouTube channel, various videos are available on:

  1. How to work with 3D printing resins:

    Video 1: The basics of printing with resin. Source: Henkel.
  2. How to properly store 3D printing resins:

    Video 2: How to properly store resins. Source: Henkel.
  3. How to post-process parts 3D printed with resin:

    Video 3: Resin post-processing tips. Source: Henkel.

The material's technical and safety datasheets can be found in the Downloads section. On the manufacturer's website the user can find the printer validation information as well as the recommended printing and postprocessing settings.

Featured properties

Technology
DLP/LCD

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