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IND147 HDT230 High Heat resin - Loctite 3D

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IND147 resin - Loctite 3D

Ref.: RS-LOC-IND147-HDT230-BLACK-1KG

260.00 €

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In stock 6 units available for immediate shipping.
units available for shipping in 5 - 7 days Available for shipment within 5 - 7 days

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Approximate delivery date: Friday 22 November

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The main feature of the IND147 HDT230 High Heat resin from the Loctite family of high temperature resistant resins is its resistance to heat with a HDT of 230 ºC. This property makes the parts 3D printed with this resin maintain great dimensional stability, especially for low loads processes in molding applications. Furthermore, parts 3D printed with the IND147 HDT230 High Heat resin have a good surface finish and enough toughness to withstand molding processes (e.g., polyurethane and silicone molding).

Video 1: The IND147 HDT230 High Heat resin. Source: Loctite.

The IND147 HDT230 High Heat resin is the perfect material for applications such as tooling at high temperatures and low pressure, the prototyping of high temperature parts and the preparation of customized molds in sectors such as industrial manufacturing, consumer goods or automotive.

The IND147 HDT230 High Heat resin has been formulated to print optimally on industrial DLP printers. Before printing with this material, the user should read safety and technical information available in the Downloads section. In the Usage Tips section useful resources can be found on printer compatibility, recommended post-processing settings, and proper resin storage.

Curing, washing, and sintering properties
Washing time	2 min
Curing time	10 min

General information
Manufacturer	Loctite
Material	Photopolymer
Format	1 kg / 5 kg
Technology	DLP/LCD
Wavelength	- nm
Viscosity	(ASTM D7867) @ 25 ºC: 2100 ± 200 cP
Density (solid)	(ASTM D1475) 1.26 g/cm³
Density (liquid)	(ASTM D1475) 1.15 g/cm³

Electrical properties
Volumetric resistivity	(ASTM D257) 3.56 E+16 Ω·cm
Surface electrical resistivity	(ASTM D257) 3.38 E+16 Ω
Dielectric strength	(ASTM D149) 29 ± 2 kV/mm
Dielectric constant	(ASTM D150) 2.8-3.0
Dissipation factor	(ASTM D150) -0.002 - 0.016

Printing properties
Layer height	- µm
Layer exposure time	-
Layer off time	-
Lifting height	- mm
Bottom layer exposure	-
Bottom layer count	-

Mechanical properties
Izod impact strength	- KJ/m²
Charpy impact strength	- KJ/m²
Elongation at break	(ASTM D638) 2.4 ± 0.7 %
Tensile strength	(ASTM D638) 67 ± 16 MPa
Tensile modulus	(ASTM D638) 3190 ± 80 MPa
Flexural strength	(ASTM D790) 120 ± 4 MPa
Flexural modulus	(ASTM D790) 3690 ± 60 MPa
Surface hardness	(ASTM D2240) Shore 94 D

Thermal properties
Softening temperature	291 ºC
Heat deflexion temperature	(ASTM D648) @ 0.45 MPa: 291 ± 15 ºC / @ 1.82 MPa: 163 ± 4 ºC
Thermal expansion coefficient	(ASTM E831) 114 µm/(m· ºC)
Thermal conductivity	(ASTM D5930) 0.2 W/(m·K)

Specific properties
Maximum water absorption	(ASTM D570) 24 h: 0.25 %

Other
HS Code	2916.1
Lifetime (since manufacturing)	- M

On the Henkel YouTube channel, various videos are available on:

How to work with 3D printing resins:
Video 1: The basics of printing with resin. Source: Henkel.
How to properly store 3D printing resins:
Video 2: How to properly store resins. Source: Henkel.
How to post-process parts 3D printed with resin:
Video 3: Resin post-processing tips. Source: Henkel.

The material's technical and safety datasheets can be found in the Downloads section. On the manufacturer's website the user can find the printer validation information as well as the recommended printing and postprocessing settings.